Peeling device
The material width supports 35mm to 160mm for TAB/CSP/COF and 250mm to 300mm for FPC!
The product is a device for removing photoresist and backstop agents after etching. The transport speed is 2.0 m/min, and the material width is 35 mm to 160 mm for TAB/CSP/COF, and 250 mm to 300 mm for FPC. The device consists of unwinding, peeling, washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25 μm and above ■ Processing surface: Single side ■ Utilities: Power supply AC 200/220V 50Hz/60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 16mL × 2.5mW × 2.5mH (excluding control panel and ancillary equipment) *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
